916715-2产品详细规格

Rohs	Contains lead / RoHS non-compliant
标准包装	90
型	PGA. ZIF (ZIP)
位置或引脚数（格）	321 (19 x 19)
球场	0.100 (2.54mm)
安装类型	Through Hole
特点	Open Frame
触点表面涂层	Gold
触点涂层厚度	15µin (0.38µm)
Heat Sink Style	Universal
Pick and Place Cover	None
Contact Style	Stamped + Formed
Housing Material	High Temperature Thermoplastic
Application	Production
ZIF Actuator	Handle
Chip Compatibility	Any Socket 7 Chip. Cyrix. Intel® Pentium®
PCB Mount Style	Thru Hole
Number of Positions	321
Profile	Low
Lead Free Solder Processes	Reflow solder capable to 245°C. Reflow solder capable to 260°C
Solder Tail Contact Plating	Tin-Lead over Nickel
Brand	AMP
Housing Color	Natural
Insulation Resistance (MΩ)	5.000
RoHSELV Compliance	ELV compliant. 5 of 6 Compliant
Frame Style	Open
Packaging Method	Tray
Packaging Quantity	90 sockets/box
Heat Sink Attachment	With
Contact Mating Area Plating Material	Gold (15)
Insertion Force	Zero
Housing Flammability Rating	UL 94V-0
Grid Spacing (mm (in))	Interstitial: 1.27 x 2.54 [.050 x .100]
Leg Style	Standard
Comment	A Universal Style consists of 2 Z-Springs and 2 Center strap heat sink latches.
Socket Identifier	Socket 7
Grid Size	19x19
Cover Material	High Temperature Thermoplastic
Housing Material Temperature	High
Contact Material	Copper Alloy
Termination (Solder) Post Length (mm (in))	2.36 [0.093]
Features	Open Frame
Mounting Type	Through Hole
Pitch	0.100 (2.54mm)
Contact Finish	Gold
Number of Positions or Pins (Grid)	321 (19 x 19)
Standard Package	90
Contact Finish Thickness	15µin (0.38µm)
Type	PGA. ZIF (ZIP)
rohs	Contains lead / RoHS non-compliant

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